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MINISTRY OF EDUCATION AND TRAINING OF VIETNAM
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SOCIALIST REPUBLIC OF VIETNAM
Independence - Freedom - Happiness
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No. 1314/QD-BGDDT
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Hanoi, May 13, 2025
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DECISION
PROMULGATION OF TRAINING PROGRAM STANDARDS ON SEMICONDUCTOR
INTEGRATED CIRCUITS AT UNDERGRADUATE AND MASTER’S LEVELS
MINISTER OF EDUCATION AND TRAINING OF
VIETNAM
Pursuant to the Law on
Higher Education dated June 18, 2012 and the Law on amendments to the Law on
Higher Education dated November 19, 2018;
Pursuant to Decree No.
37/2025/ND-CP dated February 26, 2025 of the Government of Vietnam on
functions, tasks, entitlements, and organizational structure of the Ministry of
Education and Training of Vietnam;
Pursuant to Circular
No. 17/2021/TT-BGDDT dated June 22, 2021 of the Minister of Education and
Training of Vietnam on standards and formulation, appraisal, and promulgation
of training programs of higher education;
Pursuant to Circular
No. 09/2022/TT-BGDDT dated June 6, 2022 of the Minister of Education and
Training of Vietnam on the list of academic majors in higher education;
At the request of the
Director of the Department of Higher Education.
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Article 1. The Training Program Standards on semiconductor integrated
circuits (ICs) at undergraduate and master’s levels is promulgated together
with this Decision.
Article 2. This Decision comes into force as of its date of signing.
Article 3. The Training Program Standards on semiconductor ICs shall
apply to higher education institutions participating in the implementation of
the Program on the development of personnel for the semiconductor industry by
2030, with an orientation toward 2050 under decision No. 1017/QD-TTg dated
September 21, 2024 of the Prime Minister of Vietnam; higher education
institutions shall develop, review, and update training programs, ensure
compliance with the criteria of the Training Program Standards on semiconductor
ICs, and submit reports to the Ministry of Education and Training of Vietnam
before student admissions.
Article 4. Chief of Office, Director of the Department of Higher
Education, Directors of relevant units of the Ministry of Education and
Training of Vietnam; Principals, Directors of higher education institutions,
heads of organizations, and relevant individuals shall implement this
Decision./.
PP. MINISTER
DEPUTY MINISTER
Hoang Minh Son
TRAINING PROGRAM STANDARDS
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1. OVERVIEW
1.1. Introduction
The Training Program
Standards on semiconductor ICs at undergraduate and master’s levels
(hereinafter referred to as “Training Program Standards”) refers to the
mandatory general requirements applicable to all training programs in relevant
majors at undergraduate and master’s levels according to current regulations on
participation in personnel training for the semiconductor industry. The
Training Program Standards include requirements for objectives, graduation
requirements, admission requirements, credit load, structure and content,
teaching and result assessment methods, faculty and support personnel,
facilities, technology, and learning materials.
The Training Program
Standards are developed based on Circular No. 17/2021/TT-BGDDT dated June 22,
2021 of the Minister of Education and Training of Vietnam. They also align with
the Vietnam National Qualification Framework according to Decision No.
1982/QD-TTg dated October 18, 2016 of the Prime Minister of Vietnam. The
development process of the Training Program Standards involves experts and
scientists in the semiconductor field. It is also consulted widely with
training institutions, employers, and graduates of training programs concerning
semiconductor ICs and the requirements for the respective training programs of
countries and territories with developed economies, such as the United States,
Germany, France, the Netherlands, Japan, South Korea, and Taiwan.
The Training Program
Standards serve as the ground for training institutions to develop and
implement training programs on semiconductor ICs. Such standards are also the
foundation for designing and implementing major-minor, dual-degree, or
interdisciplinary programs on semiconductor ICs.
Training institutions
may, based on the training orientation and practical conditions, develop
teaching programs that are partially or fully in English to enhance learners’
foreign language proficiency and gradually meet international standards.
Additionally, the programs must equip learners with interdisciplinary skills,
such as programming, simulation, and data analysis, to help them develop
technological thinking and the ability to work in global environments, thus
meeting domestic and personnel demands in the semiconductor industry.
1.2. List of training
majors for semiconductor industry personnel
The list of training
majors relevant to semiconductor ICs that may contribute to the personnel
training for the semiconductor industry under current regulations includes:
No.
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Training major
Note
I. Undergraduate
level
1
7440102
Physics
2
7440110
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3
7440112
Chemistry
4
7440122
Materials Science
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7460107
Computational Science
6
7460108
Data Science
7
7480101
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8
7480102
Computer Networks and
Data Communications
9
7480103
Software Engineering
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7480104
Information Systems
11
7480106
Computer Engineering
12
7480107
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13
7480108
Computer Technology
Engineering
14
7480201
Information Technology
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7480202
Information Security
16
7480208
Cybersecurity
Pilot Program
17
7510201
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18
7510203
Mechatronic Engineering
Technology
19
7510206
Thermal Engineering
Technology
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7510301
Electrical and
Electronics Engineering Technology
21
7510302
Electronics and
Telecommunications Engineering Technology
22
7510303
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23
7510401
Chemical Engineering
Technology
24
7510402
Materials Technology
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7520101
Engineering Mechanics
26
7520103
Mechanical Engineering
27
7520114
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28
7520115
Thermal Engineering
29
7520107
Robotics Engineering
Pilot Program
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7520117
Industrial Engineering
31
7520201
Electrical Engineering
32
7520207
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33
7520215
Electrical and
Electronics Engineering
Pilot Program
34
7520216
Automation and Control
Engineering
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7520301
Chemical Engineering
36
7520309
Materials Engineering
37
7520310
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38
7520401
Engineering Physics
II. Master’s level
1
8440104
Solid-state Physics
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2
8440105
Radio and Electronics
Physics
3
8440107
Solid Mechanics
4
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Mechanics
5
8440110
Optics
6
8440112
Chemistry
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7
8440113
Inorganic Chemistry
8
8440114
Organic Chemistry
9
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Analytical Chemistry
10
8440119
Theoretical and
Physical Chemistry
11
8440122
Materials science
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12
8460107
Computational Science
13
8460108
Data Science
14
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Mathematical
Foundations of Informatics
15
8480101
Computer Science
16
8480102
Computer Networks and
Data Communications
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17
8480103
Software Engineering
18
8480104
Information Systems
19
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Computer Engineering
20
8480107
Artificial Intelligence
21
8480201
Information Technology
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22
8480202
Information Security
23
8480204
IT Management
24
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Information System
Management
25
8520101
Engineering Mechanics
26
8520103
Mechanical Engineering
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27
8520114
Mechatronic Engineering
28
8520117
Industrial Engineering
29
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Energy Engineering
30
8520201
Electrical Engineering
31
8520203
Electronic Engineering
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32
8520208
Telecommunications
Engineering
33
8520209
Cryptographic
Engineering
34
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Automation and Control
Engineering
35
8520301
Chemical Engineering
36
8520309
Materials Engineering
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37
8520401
Engineering Physics
In addition to the
training majors listed above, any other training major approved by the Minister
of Education and Training of Vietnam for pilot implementation or inclusion in
the list of training programs at undergraduate and master’s levels concerning
semiconductor ICs shall comply with these Training Program Standards.
1.3. Graduation
degrees
Graduates of training
programs on semiconductors ICs at the undergraduate level shall receive
bachelor’s degrees. Graduates of specialized in-depth training programs at
level 6 shall receive engineer’s degrees (level 6), and at level 7, engineer’s
decrees (level 7). Graduates of training programs on semiconductor ICs at the
master’s level shall receive master’s degrees.
2. TRAINING PROGRAM STANDARDS
2.1. Training program
objectives
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2.2. Graduation
requirements of training programs
Graduation requirements
of training programs on semiconductor ICs must align with the graduation
requirements of the Vietnam National Qualification Framework and the Training
Program Standards of the respective industry/field/training major. Training
institutions shall develop graduation requirements with appropriate competency
levels, ensuring mandatory compliance with Bloom’s Taxonomy corresponding to
each training level (Bachelor, Engineer, and Master). Graduates of training
programs on semiconductor ICs must meet the minimum competency levels according
to the table below:
Graduation requirements
Minimum competency level
Bachelor
Engineer (level 6)
Engineer (level 7)
Master
(1) Knowledge: Ability
to determine, define, and solve complex engineering problems concerning
semiconductor ICs by applying principles of mathematics, science, and
engineering
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Level 4
Level 4
Level 4
(2) Knowledge: Ability
to apply engineering designs to develop solutions that meet specific needs
concerning semiconductor IC engineering while considering public health,
safety, welfare, and global, cultural, social, environmental, and economic
factors in conformity with professional ethics
Level 3
Level 4
Level 4
Level 4
(3) Skill: Ability to
communicate effectively with multiple subjects and concerned parties,
including technical experts, leaders, and non-specialists, ensuring clarity
and accuracy in information delivery
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Level 3
Level 4
Level 4
(4) Skill: Ability to
work effectively in a professional team setting where members jointly
demonstrate leadership, foster collaborative and inclusive environments, set
objectives, formulate task plans, and achieve common objectives
Level 3
Level 3
Level 4
Level 4
(5) Skill: Ability to
develop and conduct appropriate experiments concerning semiconductor ICs,
analyze and interpret data scientifically, and apply engineering judgment to
draw relevant conclusions
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Level 3
Level 4
Level 4
(6) Autonomy and
responsibility: Ability to recognize ethical and professional
responsibilities in technical situations and make informed judgments
considering the impact of technical solutions in global, economic,
environmental, and social contexts, ensuring sustainability
Level 3
Level 3
Level 4
Level 4
(7) Autonomy and
responsibility: Ability to acquire and apply new knowledge to keep pace with
the rapid technical developments of semiconductor IC technologies through
appropriate learning strategies, ensuring lifelong learning
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Level 3
Level 4
Level 4
(8) Foreign language
proficiency: corresponding to each training level as specified in Vietnam’s
6-level Foreign Language Proficiency Framework
3/6
3/6
4/6
4/6
The following graduation
requirements are specifically designed for in-depth directions concerning
semiconductor ICs, such as IDM, Fabless Design, Foundry, and Tool Manufacturer.
Training institutions may integrate the content of the in-depth graduation
requirements into the above 8 graduation requirements of training programs on
semiconductor ICs, ensuring conformity with the objectives and orientations of
the training programs.
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Training programs
concerning IDM that are combined with knowledge of Electronics (Electrical
Engineering, Electronics, and Telecommunications), Computer Engineering,
Physics, Materials Science, Engineering Physics, Chemistry, Chemical
Engineering, Mechanical Engineering, Engineering Mechanics, Mechatronics,
Robotics Engineering, etc., to train learners to master several stages in the
IC manufacturing process, from design and manufacturing to testing.
The graduation
requirements of training programs in this direction emphasize the ability to
manage and operate the IC manufacturing process, ensuring high-quality design,
manufacturing, and inspection of the products in conformity with the needs of
IDM companies. Graduates of training programs in the IDM direction must meet
the minimum competency levels specified in the table below:
Graduation requirements
Minimum competency level
Bachelor
Engineer (level 6)
Engineer (level 7)
Master
(1) Knowledge: Ability
to apply knowledge from physics, chemistry, electronics, mechanics,
informatics, or relevant fields in designing, manufacturing, and testing
semiconductor ICs, ensuring high productivity and reliability in industrial
environments
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Level 4
Level 4
Level 4
(2) Knowledge: Ability
to effectively apply various software-based design and simulation methods
used during the design and manufacturing of semiconductor ICs
Level 3
Level 4
Level 4
Level 4
(3) Skill: Ability to
use specialized tools and methods for specific stages of IC design, manufacturing,
and testing, including productivity analysis in laboratory settings and
quality assessment of finished products
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Level 3
Level 4
Level 4
(4) Skill: Ability to
solve technical issues arising during IC design, manufacturing, and testing
or to implement optimization algorithms and programs to improve productivity
and extend the product lifespan
Level 3
Level 3
Level 4
Level 4
2.2.2. Fabless
design
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The graduation
requirements of training programs in the fabless design direction emphasize the
ability to design analog, digital, and mixed-signal ICs, proficiency in using
specialized design tools, and the ability to optimize the process from concept
to final design. Graduates of training programs in the fabless design direction
must meet the minimum competency levels specified in the table below:
Graduation requirements
Minimum competency level
Bachelor
Engineer (level 6)
Engineer (level 7)
Master
(1) Knowledge: Ability
to apply knowledge of mathematics, physics, electrical circuits, signals and
systems, and computer architecture to analyze and understand the technical
criteria of semiconductor ICs
Level 3
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Level 4
Level 4
(2) Knowledge: Ability
to apply knowledge of electrical circuits, analog electronics, digital
electronics, programming techniques, and artificial intelligence (AI) to
analyze, calculate, design, and simulate semiconductor ICs
Level 3
Level 4
Level 4
Level 4
(3) Skill: Ability to
perform verification, logic synthesis, physical design, and assessment of
technical targets of semiconductor ICs based on skills in circuits, analog
electronics, digital electronics, measurement techniques, and semiconductor
components
Level 3
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Level 4
Level 4
(4) Skill: Ability to
inspect, measure, and assess technical targets of a semiconductor IC based on
skills in circuits, analog electronics, digital electronics, measurement
techniques, and semiconductor components
Level 3
Level 3
Level 4
Level 4
(5) Skill: Ability to
use scripting languages and AI tools to automate the processes of
semiconductor IC design, synthesis, and verification
Level 3
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Level 4
Level 4
2.2.3. Foundry
Training programs
concerning foundry combined with knowledge of Physics, Materials Science,
Engineering Physics, Chemistry, Chemical Engineering, Electronics (Electrical
Engineering, Electronics, and Telecommunications), Mechanical Engineering,
Mechatronics, Engineering Mechanics, etc., that provide strong foundations in
material structure and properties and operational principles of semiconductor
components and methods for handling and manufacturing ICs.
The graduation
requirements of training programs in the foundry direction emphasize the
ability to operate specific stages in wafer processing, including thin-film
deposition, photolithography, etching, dicing, bonding, and packaging, ensuring
high quality and productivity in semiconductor IC manufacturing. Graduates of
training programs in the foundry direction must meet the minimum competency
levels specified in the table below:
Graduation requirements
Minimum competency level
Bachelor
Engineer (level 6)
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Master
(1) Knowledge: Ability
to apply knowledge of semiconductor materials, manufacturing technologies,
and electronics engineering to analyze or perform certain stages in IC
manufacturing, such as wafer surface processing, dopant diffusion, thin-film
deposition, etching, testing, and packaging
Level 3
Level 4
Level 4
Level 4
(2) Knowledge: Ability
to apply knowledge of specific stages in IC manufacturing to identify factors
affecting productivity and product quality, ensuring that the manufacturing
meets reliability and efficiency requirements
Level 3
Level 4
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Level 4
(3) Skill: Ability to
proficiently perform certain stages in semiconductor IC manufacturing,
including wafer processing, diffusion, thin-film deposition, etching, or
quality inspection using specialized equipment, ensuring productivity and
product quality
Level 3
Level 3
Level 4
Level 4
(4) Skill: Ability to
implement solutions to error correction and manufacturing process improvement
and execute certain steps in the semiconductor IC manufacturing chain to
enhance product stability and efficiency
Level 3
Level 3
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Level 4
2.2.4. Tool
Manufacturer
Training programs
concerning the tool manufacturer direction combined with knowledge of Computer
Science, Computer Engineering, Information Technology, Artificial Intelligence,
Electronics (Electrical Engineering, Electronics, and Telecommunications),
Mechanics, Engineering Mechanics, Robotics Engineering, Mechatronics, etc.,
that emphasize the provision of interdisciplinary knowledge, combining high
technologies and automation to train learners to be able to design,
manufacture, and operate specialized equipment for IC manufacturing.
The graduation
requirements of training programs in the tool manufacturer direction emphasize
the ability to design, manufacture, and operate equipment and tools that
support the IC manufacturing process, including tools used in the semiconductor
IC manufacturing process, design software, measurement systems, and product
quality inspection systems. Graduates of training programs in the tool
manufacturer direction must meet the minimum competency levels specified in the
table below:
Graduation requirements
Minimum competency level
Bachelor
Engineer (level 6)
Engineer (level 7)
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(1) Knowledge: Ability
to apply principles of physics, informatics, and related knowledge in tools
and equipment for semiconductor IC design and manufacturing
Level 3
Level 4
Level 4
Level 4
(2) Knowledge: Ability
to apply knowledge of factors affecting the productivity of hardware or
software tools and equipment used in semiconductor IC design and manufacturing
to propose design improvements and improve product quality and operational
efficiency
Level 3
Level 4
Level 4
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(3) Skill: Ability to
design software or hardware tools and equipment in semiconductor IC design
and manufacturing using appropriate specialized software and AI techniques,
ensuring compliance with technical requirements for productivity and
reliability during the manufacturing process
Level 3
Level 3
Level 4
Level 4
(4) Skill: Ability to
implement remedial solutions to errors arising during the operation and
maintenance of software or hardware tools and equipment combined with the
application of AI to improve productivity and stability of the tools and
equipment
Level 3
Level 3
Level 4
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2.3. Admission
requirements of training programs
The admission
requirements specify the minimum qualifications, competency, and experience in
conformity with the undergraduate and master’s levels concerning semiconductor
ICs. Such requirements ensure that learners can successfully study and complete
training programs.
2.3.1.
Bachelor’s/engineer programs
Candidates shall be
admitted under the Regulation on Higher Education Admission of the Ministry of
Education and Training of Vietnam and the following requirements:
a) For admission based on
the results of the national high school graduation exam:
- The combination of
subjects for admission under the Regulation on Higher Education Admission of
the Ministry of Education and Training of Vietnam and subjects for admission
must have the following subjects:
+ Mathematics;
+ At least one Natural
Science subject relevant to training programs on semiconductor ICs.
- The total score of the
subject combination must be at least 80% of the maximum score (e.g., a minimum
of 24/30 for a 3-subject combination);
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b) For other admission
methods: the converted admission score must be equivalent to the conditions
specified in Section 2.3.1.
c) For candidates who
already have bachelor’s degrees:
- The degrees must be
relevant to the intended training major (as specified by training
institutions);
- The cumulative GPA of
completed training programs must be at least 2,8/4 (or equivalent).
d) For students
transferring from other training programs to training programs on semiconductor
ICs:
- The current training
programs must be relevant to the semiconductor IC training programs (as
specified by training institutions);
- Students must meet the
conditions specified in Point a of Section 2.3.1;
- The cumulative GPA must
be at least 2,5/4 (or equivalent).
2.3.2. Master’s
programs
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2.4. Credit load
The minimum credit load
of a training institution must comply with the requirements of the Vietnam
National Qualification Framework, specifically:
a) Bachelor’s program:
120 credits/Engineer (level 6) program: 150 credits, in addition to Physical
Education and National Defense and Security Education under current
regulations.
b) Engineer (level 6)
program: 150 credits in addition to Physical Education and National Defense and
Security Education under current regulations.
c) Master’s program: 60
credits for those holding bachelor’s degrees in the same discipline.
2.5. Structure and
content of training programs
The structure includes
General Education, Professional Education, Supporting Knowledge, and Graduation
Modules.
a) General Education
includes courses in political theory, law, physical education, national defense
and security education as specified in current regulations. Mathematics, Basic
Science, and Informatics/IT must account for at least 30 credits, specifically
designed for each training major concerning semiconductor ICs.
b) The time spent on
experiments and practical training must account for at least 25% of the total
credits in professional education and graduation modules for Bachelor’s and
Engineer (level 6) programs; 30% of the total credits in professional education
and graduation modules for Engineer (level 7) programs.
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d) Internships and
real-world experiences of training programs are encouraged to be conducted at
industrial facilities or in-depth research laboratories concerning
semiconductor ICs. Graduation theses/projects/dissertations or modules must
research and resolve problems related to one of the key stages in the
semiconductor industry value chain.
2.6. Teaching and
assessment methods
2.6.1. Teaching
methods
The teaching methods are
designed based on a learner-centered approach where the learner is the central
figure in the training process. This approach encourages active participation,
creativity, and initiative in learning activities while providing clear
orientations to ensure the achievement of graduation requirements for each
module, each component, and the overall training program.
a) Undergraduate
level: A combination of multiple methods
is applied to optimize teaching effectiveness and leverage of technology in
high education, specifically:
- Lecture;
- Tutorial;
- Practical Class;
- Laboratory Work;
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- Role Play/Simulation;
- Case Study;
- Blended Learning;
- Open & Distance
Learning.
b) Master’s level: A combination of teaching methods is applied to improve
learning outcomes, specifically:
- Lecture;
- Industrial Visits;
- Case Study;
- Problem-based Learning
PBL;
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- Interactive Learning;
- Research
Seminars/Workshops;
- Field Research;
- Supervision of
Dissertation.
2.6.2. Learning
outcome assessment
a) The assessment of
learning outcomes is designed to align with the level of achievement of the
graduation requirements for each module and training program. The assessment
process focuses on theoretical knowledge and evaluates practical competencies,
problem-solving abilities, skills, and learning attitudes to reflect learners’
overall competency.
b) A combination of
formative and summative assessment methods is applied, including practical
exercises, midterm tests, group/individual projects, and final exams.
c) Assessment methods are
diverse and specifically designed for the characteristics of each module and
its teaching methods, ensuring objectivity, reliability, and fairness.
d) Learners are
encouraged to accumulate knowledge through independent research and scientific
projects concerning semiconductor ICs. Such works may be converted into bonus
points for relevant courses.
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- Formative assessment:
Learning attitude, class attendance, individual/group assignments, midterm
tests, and participation in laboratory practice.
- Summative assessment:
Final exams or alternative forms of assessment, such as project reports,
presentations, or real-world simulations.
e) Training institutions
shall stipulate appropriate weightings among assessment components to
accurately reflect learners’ competencies and level of graduation requirements
achieved. The assessment criteria and weightings must be clearly announced at
the beginning of each module. Additionally, regular updates and improvements to
assessment methods are carried out to meet practical requirements concerning
semiconductor ICs and modern technologies.
2.7. Faculty and
support personnel
Faculty and support
personnel of training programs on semiconductor ICs must meet the current
regulations and the following requirements:
2.7.1.
Bachelor’s/Engineer (level6) programs
a) There must be at least
1 PhD holder in a relevant field with expertise in semiconductor ICs working as
a tenured lecturer with a minimum of 3 years of experience in higher education
teaching or training management, capable of taking charge of the development,
design, and implementation of training programs.
b) There must be at least
5 PhD holders with relevant expertise working as tenured lecturers to take
charge of the teaching of programs. Each program component must be led by a
lecturer whose expertise aligns with the teaching content. A lecturer is
considered to have relevant expertise if he/she meets the Training Program
Standards of the Ministry of Education and Training of Vietnam and the
following requirements:
- The lecturer holds a
PhD or master’s degree in a field determined by the training institution’s
Training and Science Council as relevant to take charge of the teaching of at
least 2 core modules in a component of the training program while having at
least 2 years of direct experience in teaching such modules in full.
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c) Lecturers teaching the
modules in the training program must have relevant expertise and be capable of
selecting, designing, and applying appropriate teaching and assessment methods
to meet the graduation requirements. Lecturers teaching theoretical modules
must have a master’s degree or higher, and teaching assistants must have at
least a bachelor’s degree. Lecturers/instructors for practical content must
have at least a bachelor’s degree and be capable of guiding students and
operating related equipment/software for practical training.
d) Each training program
must maintain at least 3 guest lecturers participating in the teaching whose
current work concerns semiconductor ICs with at least 5 years of in-depth practical
experience. Guest lecturers must not be responsible for teaching an entire
module in the training program.
dd) There must be
sufficient support staff to assist training activities at lecture halls
(operating teaching equipment) and support learners in libraries, learning
material centers, computer labs, and self-study/research spaces.
2.7.2. Engineer
(level 7) programs
The faculty and support
personnel of Engineer (level 7) programs must meet the requirements applicable
to Bachelor’s/Engineer (level 6) programs. Additionally, lecturers of in-depth
modules (level 7) must meet the requirements applicable to lecturers with
master’s degrees and have in-depth practical experience in the semiconductor
industry.
2.7.3. Master’s
programs
a) There must be at least
1 PhD holder in a relevant field with expertise in semiconductor ICs working as
a tenured lecturer with a minimum of 5 years of experience in higher education
teaching or training management, capable of taking charge of the development,
design, and implementation of training programs.
b) Lecturers teaching
in-depth modules and supervising theses must have published scientific research
or in-depth practical experience in the semiconductor industry.
2.8. Facilities,
technologies, and learning materials
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b) General laboratories,
electronic practice rooms, computer labs, learning and training management
systems, and specialized tools for teaching, learning, and research concerning
semiconductor ICs in accordance with the requirements of the training programs
must be adequately provided, easily accessible, and regularly maintained and
upgraded.
c) Library services,
computer infrastructures, information, and specialized resources concerning
semiconductor ICs must be sufficiently available to effectively support
learners and lecturers in learning, research, and professional development.
Libraries must offer a wide range of specialized materials, especially
reference materials in English, to help learners and faculty access the latest
global knowledge and technologies.
d) Computer
infrastructures must have specifications capable of handling complex
applications and simulations, ensuring connection with international databases
for research purposes.
dd) There must be at
least 3 strategic partner enterprises operating in the semiconductor industry
that participate in developing programs, training, and offering internship
opportunities for learners.
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